Introduction of the developed product polyimide sheet "TECASINT".
Polyimide film can be used as a thin sheet material by thermally bonding it with a vacuum press. It is expected to have various applications such as substrates, insulation, and structural materials.
By layering and pressing conventional polyimide films, it has become possible to machine them into a sturdy sheet material. While retaining the heat resistance, electrical insulation, mechanical strength, and chemical properties traditionally associated with polyimide films, we can now offer thickness sizes of 0.3 to 0.5t that were previously unavailable through laminated thermal bonding of the films. As insulation and thermal insulation materials. As components for semiconductor manufacturing equipment, etc. As electronic components and substrates. We anticipate demand in various fields. Please feel free to contact us.
- Company：ナラサキ産業 メカトロソリューション部 機能材料課
- Price：Other
